Methods of forming spaced conductive regions, and methods of forming capacitor constructions

ABSTRACT

The invention includes a method of forming spaced conductive regions. A construction is formed which includes a first electrically conductive material over a semiconductor substrate. The construction also includes openings extending through the first electrically conductive material and into the semiconductor substrate. A second electrically conductive material is formed within the openings and over the first electrically conductive material and is in electrical contact with the first electrically conductive material. The second electrically conductive material is subjected to anodic dissolution while the first electrically conductive material is electrically connected to a power source. The second electrically conductive material within the openings becomes electrically isolated from the first electrically conductive material as the dissolution progresses, and some of the second electrically conductive material remains within the openings in the substrate as spaced conductive regions after the anodic dissolution.

TECHNICAL FIELD

The invention pertains to methods of forming spaced conductive regions,and in particular aspects pertains to methods of forming capacitorconstructions.

BACKGROUND OF THE INVENTION

Capacitor constructions are utilized in numerous semiconductor devicesincluding, for example, dynamic random access memory (DRAM) devices.Capacitor constructions comprise a pair of conductive nodes separatedfrom one another by dielectric material, and accordingly capacitivelycoupled with one another. The conductive components of capacitorconstructions can comprise numerous materials, including, for example,metals, metal alloys, and conductively-doped semiconductive materials(such as, for example, conductively-doped silicon). There can beadvantages to utilizing metals in capacitor constructions, and recentlythere have been efforts to incorporate various so-called noble metalsinto capacitor constructions. Exemplary noble metals are platinum,rhodium, iridium and ruthenium.

Various problems are encountered during attempts to incorporate noblemetals into capacitor constructions. For instance, it is typicallydesired that an array of capacitor constructions be simultaneouslyformed. Ultimately, it is desired to form numerous conductive storagenodes associated with the array. The individual storage nodes are spacedfrom one another, and can accordingly be considered spaced conductiveregions. However, it can be difficult to pattern various metals intospaced conductive regions. For instance, it is found that platinum willsmear during various traditional semiconductor fabrication steps (suchas, for example, chemical-mechanical polishing). The smearing caninhibit formation of a bottom electrode in a container.

In light of the above-described difficulties, it is desirable to developnew methods of forming spaced conductive regions associated withsemiconductor constructions; and it is further desirable that such newmethods be suitable for utilization in capacitor fabrication.

It is noted that although the invention was motivated by the problemsdiscussed above, the invention is not to be limited to the applicationsdiscussed above except to the extent that the applications are expresslyrecited in the claims that follow.

SUMMARY OF THE INVENTION

In one aspect, the invention includes a method of forming spacedconductive regions associated with a semiconductor construction. Forinstance, an exemplary application of the invention is formation of abottom electrode of a container capacitor. A construction is formedwhich includes a first electrically conductive material over asemiconductor substrate. Openings extend through the first electricallyconductive material and into the semiconductor substrate. A secondelectrically conductive material is formed within the openings and overthe first electrically conductive material. The second electricallyconductive material comprises a different composition than the firstelectrically conductive material, and is in electrical contact with thefirst electrically conductive material. The second electricallyconductive material is subjected to anodic dissolution. During thedissolution, the first electrically conductive material is electricallyconnected to a power source. The second electrically conductive materialwithin the openings becomes electrically isolated from the firstelectrically conductive material as the dissolution progresses, and someof the second electrically conductive material remains within theopenings in the substrate as spaced conductive regions after the anodicdissolution. The second electrically conductive material can besubsequently incorporated into a container-shaped capacitor as a bottomelectrode.

In further aspects, the invention pertains to methods of formingcapacitor constructions.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below withreference to the following accompanying drawings.

FIG. 1 is a diagrammatic, cross-sectional view of a semiconductor waferfragment at a preliminary processing stage of a method of the presentinvention.

FIG. 2 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 1.

FIG. 3 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 2.

FIG. 4 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 3.

FIG. 5 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 4.

FIG. 6 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 5.

FIG. 7 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 6.

FIG. 8 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 3, and in accordance with an alternativeembodiment of the invention relative to that described with reference toFIG. 4.

FIG. 9 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 8.

FIG. 10 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 2, and in accordance with yet anotherembodiment of the invention.

FIG. 11 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 10.

FIG. 12 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 11.

FIG. 13 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 12.

FIG. 14 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 13.

FIG. 15 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 6, in accordance with an alternative aspectof the invention relative to that shown in FIG. 7.

FIG. 16 is a view of the FIG. 1 fragment shown at a processing stagesubsequent to that of FIG. 15.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

An exemplary aspect of the invention is described with reference toFIGS. 1-7. Referring initially to FIG. 1, a construction 10 isillustrated at a preliminary process stage. Construction 10 comprises abase 12 having an electrically insulative material 14 thereover. Base 12can comprise a bulk semiconductive material, such as, for example,monocrystalline silicon. The silicon can be lightly-doped withbackground p-type and/or n-type dopant. In particular aspects, base 12will correspond to a fragment of a monocrystalline silicon wafer.

Insulative mass 14 can comprise, for example, borophosphosilicate glass(BPSG), silicon dioxide and/or silicon nitride.

A plurality of structures are illustrated associated with base 12. Thestructures include diffusion regions 16, 18, 20, 22, 24 and 26 extendinginto base 12. The diffusion regions can comprise, for example, eithern-type or p-type doped regions of the semiconductive material of base12.

Isolation regions 28, 30 and 31 are shown extending into base 12 andelectrically separating some of the diffusion regions from one another.Isolation regions 28, 30 and 31 can correspond to, for example, shallowtrench isolation regions, or other suitable isolation regions.

Transistor gates 32, 34, 36 and 38 are formed over base 12, and betweenvarious of the diffusion regions. Sidewall spacers 40 are formed alongthe sidewalls of the transistor gates. The transistor gates can compriseconventional constructions, and in particular aspects can comprise agate oxide having various conductive materials formed thereover.Sidewall spacers 40 can also comprise conventional constructions, and inparticular aspects can comprise silicon nitride and/or silicon dioxide.

Conductive pedestals 42, 44, 46 and 48 are shown formed in electricalconnection with source/drain regions 16, 20, 22, and 26, respectively.The conductive pedestals can be referred to as electrical nodes in thediscussion that follows. The electrical nodes are ultimately utilizedfor electrical connection of capacitor constructions (described below)with the underlying source/drain regions in forming DRAM constructions.It is to be understood that the conductive pedestals are optional, andcan be eliminated in various aspects of the invention.

A DRAM cell is typically understood to comprise a capacitor gatedlyconnected to a bitline through a transistor gate. Accordingly, gate 32can be incorporated into a DRAM cell by electrically connectingelectrical node 42 to a capacitor (described below) and electricallyconnecting diffusion region 18 to a bitline (not shown). Similarly, eachof transistors 34, 36 and 38 can be incorporated into DRAM cells. It isnoted that a bitline connected with source/drain region 18 would beshared between a DRAM cell comprising transistor gate 32 and anotherDRAM cell comprising gate 34.

An electrically conductive material 50 is formed over insulative mass14. Conductive material 50 can comprise, for example, tungsten.

A patterned mask 52 is formed over material 50. Mask 52 can comprise,for example, photoresist; and can be patterned utilizingphotolithographic processing.

Openings 54, 56, 58 and 60 extend between spaced portions of mask 52.

In describing the various applications of the invention which follow, itis useful to utilize the term “substrate” to refer to various supportingstructures, and combinations of supporting structures, of construction10. Accordingly, the terms “semiconductive substrate” and “semiconductorsubstrate” are defined to mean any construction comprisingsemiconductive material, including, but not limited to, bulksemiconductive materials such as a semiconductive wafer (either alone orin assemblies comprising other materials thereon), and semiconductivematerial layers (either alone or in assemblies comprising othermaterials). The term “substrate” refers to any supporting structure,including, but not limited to, the semiconductive substrates describedabove.

In various aspects of the discussion that follows, base 12 can bereferred to as a substrate; in other aspects the combination of base 12and mass 14 can be referred to as a substrate; and in yet other aspectsthe combination of base 12, mass 14 and conductive material 50 can bereferred to as a substrate.

Referring to FIG. 2, openings 54, 56, 58 and 60 are extended throughconductive material 50 and into mass 14. In the shown aspect of theinvention, the openings are extended to expose uppermost surfaces ofconductive pedestals 42, 44, 46 and 48. After the openings are extendedinto material 50, patterned mask 52 (FIG. 1) is removed.

As discussed above, the term “substrate” can be utilized to refer to acombination of base 12 and mass 14. In such description, material 50 canbe considered to be formed over the substrate comprising base 12 andmass 14. Further, the openings 54, 56, 58 and 60 of FIG. 2 can beconsidered to be extended into the substrate comprising base 12 and mass14. In other aspects, base 12 can itself be considered a substrate, andmass 14 can be considered a material formed over the substrate. In suchaspects, the openings would be considered formed into mass 14, but notwithin the substrate supporting mass 14.

Referring to FIG. 3, a conductive material 70 is formed within openings54, 56, 58 and 60, as well as over conductive material 50. In the shownaspect of the invention, conductive material 70 is formed to be inphysical and electrical contact with the nodes 42, 44, 46 and 48.

Conductive material 70 comprises a different composition than conductivematerial 50. Conductive materials 50 and 70 can be referred to as firstand second conductive materials, respectively.

In particular aspects of the invention conductive material 70 cancomprise a so-called noble element, such as, for example, platinum,rhodium, iridium and ruthenium. Conductive material 70 can comprise thenoble metals in elemental form, or can comprise alloys containing one ormore of the noble metals. In an exemplary aspect of the invention, firstconductive material 50 comprises tungsten and second conductive material70 comprises platinum. In further aspects, first conductive material 50can consist or consist essentially of tungsten; and second material 70can consist or consist essentially of platinum.

In the application of FIG. 3, second conductive material 70 is formed toonly partially fill openings 54, 56, 58 and 60; and accordingly thesecond conductive material narrows the openings.

Referring to FIG. 4, construction 10 is provided within a vessel (notshown) and an electrolytic solution 72 is provided over conductivematerial 70. A power source 74 is provided in electrical connection withconductive material 50 and electrolytic solution 72, and subsequentlypower is provided from source 74 to cause anodic dissolution of material70. It can be preferred that inhibitors not be utilized during theanodic dissolution, with exemplary inhibitors being large organicmaterials such as metal acetates.

It is noted that although material 50 appears to be in the form ofdiscrete and separate islands in the cross-sectional view of FIG. 4, thematerial is preferably physically continuous over an upper surface ofmass 14. Accordingly, the apparent islands in the cross-sectional viewof FIG. 4 would actually be interconnected with one another throughexpanses of material extending into and out of the page relative to theFIG. 4 view. Material 50 thus forms a continuous conductive layerextending across an upper surface of mass 14. Such upper layer isutilized to provide an electrical connection to material 70 during theanodic dissolution of material 70. In particular aspects, layer 50 isutilized to maintain an electrical bias along all areas (except areaswithin openings) on a front surface of a semiconductor constructionduring the anodic dissolution of material 70.

At the initial stage of anodic dissolution of FIG. 4, material 70 isexposed to electrolytic solution 72 and material 50 is not. Accordingly,material 70 dissolves through the anodic dissolution process andmaterial 50 is protected from anodic dissolution by the overlying massof material 70. However, as the dissolution progresses, material 70 isremoved from over upper surfaces of material 50 and accordingly material50 can also be subjected to anodic dissolution. Preferably, material 50is provided to a sufficient thickness so that a continuous layer ofmaterial 50 remains over mass 14 during the anodic dissolution ofmaterial 70, and accordingly, material 50 remains a continuousconductive layer over mass 14 during the anodic dissolution process. Itis noted that if too much of material 50 is removed during the anodicdissolution, then islands of conductive material can form over mass 14,with such islands not being electrically connected to power source 74.Anodic dissolution will effectively cease at the various islands. It isdesired that such electrically isolated islands not form from material50 during an anodic dissolution process. Formation of electricallyisolated islands of material 50 can be alleviated and/or prevented byforming material 50 to be sufficiently thick so that anodic dissolutionof material 50 does not progress entirely through the thickness of thelayer of material 50 during removal of material 70. Additionally, and/oralternatively, the compositions of material 50 and 70 can be chosen sothat material 70 is more rapidly removed by anodic dissolution thanmaterial 50. For instance, material 70 can be chosen to more rapidlyoxidize under the utilized anodic dissolution conditions than doesmaterial 50.

Referring to FIG. 5, construction 10 is illustrated after the anodicdissolution process. Material 70 has been removed from physical andelectrical contact with conductive material 50. Since conductivematerial 50 is in electrical connection with power source 74 (FIG. 4),and conductive material 70 is not in electrical connection with powersource 74 except through the contact of material 70 with material 50,the anodic dissolution of material 70 stops once material 70 is nolonger in electrical contact with conductive material 50.

Portions 80, 82, 84 and 86 of conductive material 70 remain withinopenings 54, 56, 58 and 60 after the anodic dissolution. The portions ofconductive material 70 are spaced from one another, and also spaced fromconductive material 50. Accordingly, the portions of conductor material70 remaining in openings 54, 56, 58 and 60 can be referred to as spacedconductive regions. Ultimately, the spaced conductive regions can beincorporated into capacitor constructions, and accordingly the spacedconductive regions can be referred to as capacitor storage nodes 80, 82,84 and 86, respectively.

Referring to FIG. 6, conductive material 50 (FIG. 5) is removed fromover mass 14. Such can be accomplished by, for example,chemical-mechanical polishing to form a planarized upper surface 88extending across insulative material 14. In addition to, oralternatively to, chemical-mechanical polishing, the conductive material50 can be removed utilizing a wet etch or dry etch.

Referring to FIG. 7, a dielectric material 90 and a conductive material92 are formed over storage nodes 80, 82, 84 and 86. Dielectric material90 can comprise, for example, silicon dioxide, silicon nitride, tantalumpentoxide, etc. Conductive material 92 can comprise, for example,various metals and/or conductively-doped semiconductive materials (suchas, for example, conductively-doped silicon). Storage nodes 80, 82, 84and 86 can be referred to as isolated conductive masses, andaccordingly, layers 90 and 92 can be described as being formed over theconductive masses 80, 82, 84 and 86. The conductive masses 80, 82, 84and 86 are preferably capacitively separated from conductive material92. Accordingly, capacitor constructions 94, 96, 98 and 100 are formedfrom the combination of masses 80, 82, 84 and 86, dielectric material90, and conductive material 92. The capacitor constructions can beincorporated into DRAM devices, as shown.

Another aspect of the invention is described with reference to FIGS. 8and 9. In referring to FIGS. 8 and 9, similar numbering will be used aswas utilized above in describing FIGS. 1-7, where appropriate.

FIG. 8 illustrates a construction 200 at a processing step subsequent tothat of FIG. 3. Specifically, protective masses 202 are formed withinopenings 54, 56, 58 and 60. Masses 202 can comprise, for example,photoresist; and can be formed utilizing photolithographic processingand/or chemical-mechanical processing. The protective material 202 cancomprise phosphosilicate glass (PSG) alternatively to, or in additionto, photoresist. The masses 202 protect portions of material 70 withinopenings 54, 56, 58 and 60 during anodic dissolution.

Referring to FIG. 9, construction 200 is illustrated after anodicdissolution (the dissolution can be accomplished in accordance with theprocedures described previously with reference to FIG. 4). The anodicdissolution has removed material 70 from over conductive material 50,similarly to the aspect described above with reference to FIG. 5.However, material 202 has protected the conductive material 70 withinopenings 54, 56, 58 and 60. The protection of material 70 can alleviateand/or prevent the conductive material 70 from being removed too rapidlyfrom within the openings and either becoming undesirably thin, or havinggaps extending through the portions of layer 70 remaining within theopenings after the anodic dissolution.

Construction 200 of FIG. 9 can be subjected to processing similar tothat described above with reference to FIGS. 6 and 7 to incorporate thematerial 70 remaining within the openings into capacitor constructions.It is noted that if chemical-mechanical polishing is utilized to removematerial 50 (similar to the process described above with reference toFIG. 6), the protective masses 202 can remain within the openings duringthe chemical-mechanical polishing to avoid having particulates generatedduring the chemical-mechanical polishing falling onto the remainingportions of conductive material 70.

Protective masses 202 can be removed from within openings 54, 56, 58 and60 prior to formation of capacitor constructions from the spacedportions of material 70. If the protective masses comprise photoresist,they can be removed by, for example, ashing or a suitable etch; and ifthe masses comprise PSG they can be removed with a suitable etch.

Another aspect of the invention is discussed with reference to FIGS.10-14. In describing FIGS. 10-14, similar numbering will be used as wasutilized above in describing FIGS. 1-7, where appropriate.

Referring initially to FIG. 10, a construction 300 is illustrated at aprocessing step subsequent to that of FIG. 2. The construction 300 issimilar to the construction 10 of FIG. 3, in that second conductivematerial 70 has been formed over first conductive material 50, andwithin openings 54, 56, 58 and 60. However, construction 300 differsfrom the construction 10 of FIG. 3 in that second conductive material 70entirely fills the openings 54, 56, 58 and 60.

Referring to FIG. 11, construction 300 is illustrated after anodicdissolution of some of material 70. The dissolution can be accomplishedutilizing procedures described above with reference to FIG. 4. Theconductive material 70 remaining after the anodic dissolution formsspaced conductive masses 302, 304, 306 and 308 within openings 54, 56,58 and 60, respectively.

Referring to FIG. 12, first conductive material 50 (FIG. 11) is removed.The first conductive material can be removed utilizing, for example,chemical-mechanical polishing to form a planar surface 310 extendingacross insulative mass 14, and across upper surfaces of conductivemasses 302, 304, 306 and 308. It is noted that although the polishing isshown planarizing an upper surface of masses 302, 304, 306 and 308, theinvention encompasses other applications (not shown) in which the uppersurfaces of the masses 302, 304, 306 and 308 are not polished.Applications in which upper surfaces of the masses 302, 304, 306 and 308are not polished can be preferred if the masses comprise materials, suchas platinum, that can undesirably smear during a polishing process.

The conductive masses 302, 304, 306 and 308 of FIG. 12 can be consideredto comprise top surfaces 312, and sidewall surfaces 314 extendingdownwardly from the top surfaces.

Referring to FIG. 13, at least some of the insulative mass 14 is removedfrom between conductive masses 302, 304, 306 and 308 to expose thesidewall surfaces 314.

Referring to FIG. 14, dielectric material 90 and conductive material 92are formed over conductive masses 302, 304, 306 and 308. Morespecifically, the dielectric material 90 and conductive material 92 areformed over top surfaces 312 of the conductive masses, as well as alongthe sidewall surfaces 314 of the conductive masses. The masses 302, 304,306 and 308, together with dielectric material 90 and conductivematerial 92, define capacitor constructions 320, 322, 324 and 326.

Although only some of the sidewall surfaces 314 are exposed in theprocessing of FIG. 13, it is to be understood that the inventionencompasses other embodiments (not shown) wherein a sufficient amount ofmaterial 14 is removed to expose an entirety of the sidewall surfaces314 of masses 302, 304, 306 and 308.

Another aspect of the invention is described with reference to FIGS. 15and 16. In describing FIGS. 15 and 16, similar numbering will be used aswas utilized above in describing FIGS. 1-7, where appropriate.

Referring initially to FIG. 15, a construction 400 is illustrated at aprocessing step subsequent to that of FIG. 6. Construction 400 comprisesthe spaced conductive masses 80, 82, 84 and 86 which were describedpreviously with reference to FIG. 6. The thickness of insulativematerial 14 has been reduced relative to that of FIG. 6, to exposesidewall surfaces 402 of the conductive masses 80, 82, 84 and 86.

Referring to FIG. 16, dielectric material 90 and conductive material 92are formed over the conductive masses 80, 82, 84 and 86. The dielectricmaterial 90 and conductive material 92 also extend along sidewallsurfaces 402 of the conductive masses.

Although the thickness of material 14 is reduced sufficiently to onlyexpose portions of sidewall surfaces 402 of conductive masses 80, 82, 84and 86, it is to be understood that the invention encompasses otherembodiments (not shown) wherein the thickness of insulative mass 14 issufficiently reduced to expose an entire expanse of sidewall surfaces402.

In compliance with the statute, the invention has been described inlanguage more or less specific as to structural and methodical features.It is to be understood, however, that the invention is not limited tothe specific features shown and described, since the means hereindisclosed comprise preferred forms of putting the invention into effect.The invention is, therefore, claimed in any of its forms ormodifications within the proper scope of the appended claimsappropriately interpreted in accordance with the doctrine ofequivalents.

What is claimed is:
 1. A method of forming spaced conductive regionsassociated with a semiconductor construction, comprising: forming aconstruction which includes: a first electrically conductive materialover a semiconductor substrate, and openings extending through the firstelectrically conductive material and into the semiconductor substrate;and a second electrically conductive material within the openings andover the first electrically conductive material, the second electricallyconductive material being different from the first electricallyconductive material and being in electrical connection with the firstmaterial; and subjecting the construction to anodic dissolution; thefirst electrically conductive material being electrically connected to apower source during the anodic dissolution; the second electricallyconductive material within the openings becoming electrically isolatedfrom the first electrically conductive material during the anodicdissolution and remaining within the openings as the spaced conductiveregions after the anodic dissolution.
 2. The method of claim 1 whereinthe second electrically conductive material is in physical contact withthe first electrically conductive material prior to the anodicdissolution; and wherein the second electrically conductive materialbecomes physically isolated from the first electrically conductivematerial during the anodic dissolution.
 3. The method of claim 1 whereinthe second electrically conductive material is oxidized during theanodic dissolution; and wherein the oxidation of the second electricallyconductive material is more rapid than any oxidation of the firstelectrically conductive material during the anodic dissolution.
 4. Themethod of claim 1 the first electrically conductive material comprisestungsten and the second electrically conductive material comprises oneor more of platinum, rhodium, iridium, ruthenium.
 5. The method of claim1 the first electrically conductive material comprises tungsten and thesecond electrically conductive material comprises platinum.
 6. Themethod of claim 1 the first electrically conductive material consistsessentially of tungsten and the second electrically conductive materialconsists essentially of platinum.
 7. The method of claim 1 wherein acontinuous layer of the first conductive material remains over thesubstrate after the anodic dissolution; and wherein chemical-mechanicalpolishing is utilized to remove the remaining first conductive materialfrom over the substrate.
 8. The method of claim 1 wherein the substratecomprises an electrically insulative mass over a monocrystalline siliconbase; and wherein the openings extend into the electrically insulativemass.
 9. A method of forming capacitor constructions, comprising:providing a substrate; forming a first electrically conductive materialover the substrate; forming openings extending through the firstelectrically conductive material and into the substrate; forming asecond electrically conductive material within the openings and over thefirst electrically conductive material, the second electricallyconductive material being different from the first electricallyconductive material and being in electrical contact with the firstelectrically conductive material; subjecting the second electricallyconductive material to anodic dissolution; the first electricallyconductive material being electrically connected to a power sourceduring the anodic dissolution; the second electrically conductivematerial within the openings becoming electrically isolated from thefirst electrically conductive material during the anodic dissolution andremaining within the openings as spaced conductive masses after theanodic dissolution; forming dielectric material over the spacedconductive masses; and forming capacitor electrode material over thedielectric material and capacitively separated from the conductivemasses.
 10. The method of claim 9 wherein the second electricallyconductive material is in physical contact with the first electricallyconductive material prior to the anodic dissolution; and wherein thesecond electrically conductive material becomes physically isolated fromthe first electrically conductive material during the anodicdissolution.
 11. The method of claim 9 wherein the second electricallyconductive material is oxidized during the anodic dissolution; andwherein the oxidation of the second electrically conductive material ismore rapid than any oxidation of the first electrically conductivematerial during the anodic dissolution.
 12. The method of claim 9wherein the second conductive material is formed to only partially fillthe openings.
 13. The method of claim 12 wherein the second electricallyconductive material narrows the openings, and further comprising aprotective material within the narrowed openings prior to the anodicdissolution.
 14. The method of claim 13 wherein the protective materialcomprises photoresist.
 15. The method of claim 13 wherein the protectivematerial comprises PSG.
 16. The method of claim 9 wherein the secondconductive material is formed to entirely fill the openings.
 17. Themethod of claim 9 wherein the first electrically conductive material andsecond electrically conductive material are oxidized during the anodicdissolution, and wherein the second electrically conductive material isoxidized more rapidly than the first electrically conductive materialduring the anodic dissolution.
 18. The method of claim 9 the firstelectrically conductive material comprises tungsten and the secondelectrically conductive material comprises one or more of platinum,rhodium, iridium, ruthenium.
 19. The method of claim 9 wherein at leastsome of the first conductive material remains over the substrate afterthe anodic dissolution; and wherein chemical-mechanical polishing isutilized to remove the remaining first conductive material from over thesubstrate.
 20. The method of claim 9 wherein the substrate comprises anelectrically insulative mass over a monocrystalline silicon base; andwherein the openings extend into the electrically insulative mass.
 21. Amethod of forming capacitor constructions, comprising: providing asubstrate; forming a first electrically conductive material over thesubstrate; forming openings extending through the first electricallyconductive material and into the substrate; forming a secondelectrically conductive material within the openings and over the firstelectrically conductive material, the second electrically conductivematerial being different from the first electrically conductivematerial, the second electrically conductive material only partiallyfilling the openings, the second electrically conductive material beingin electrical contact with the first electrically conductive material;subjecting the second electrically conductive material to anodicdissolution; the first electrically conductive material beingelectrically connected to a power source during the anodic dissolution;the second electrically conductive material within the openings becomingelectrically isolated from the first electrically conductive materialduring the anodic dissolution and remaining within the openings asspaced conductive masses after the anodic dissolution; removing at leastsome of the first conductive material from over the substrate; formingdielectric material within the partially filled openings and over thespaced conductive masses; and forming capacitor electrode material overthe dielectric material and capacitively separated from the conductivemasses.
 22. The method of claim 21 wherein the second electricallyconductive material is in physical contact with the first electricallyconductive material prior to the anodic dissolution; and wherein thesecond electrically conductive material becomes physically isolated fromthe first electrically conductive material during the anodicdissolution.
 23. The method of claim 21 wherein the second electricallyconductive material is oxidized during the anodic dissolution; andwherein the oxidation of the second electrically conductive material ismore rapid than any oxidation of the first electrically conductivematerial during the anodic dissolution.
 24. The method of claim 21wherein the substrate comprises an electrically insulative material, andwherein the openings are formed to extend into the electricallyinsulative material.
 25. The method of claim 21 wherein the substratecomprises an electrically insulative material over conductive electricalnodes, wherein the openings are formed to extend through theelectrically insulative material and to the electrical nodes; andwherein the second conductive material is formed in physical andelectrical contact with the electrical nodes.
 26. The method of claim 25wherein the first electrically conductive material and secondelectrically conductive material are oxidized during the anodicdissolution, and wherein the second electrically conductive material isoxidized more rapidly than the first electrically conductive materialduring the anodic dissolution.
 27. The method of claim 21 the firstelectrically conductive material comprises tungsten and the secondelectrically conductive material comprises one or more of platinum,rhodium, iridium, ruthenium.
 28. The method of claim 21 whereinchemical-mechanical polishing is utilized to remove the first conductivematerial from over the substrate.
 29. The method of claim 21 wherein thesubstrate comprises an electrically insulative material over amonocrystalline silicon base; and wherein the openings extend into theelectrically insulative material.
 30. The method of claim 21 furthercomprising: forming a protective material within the partially filledopenings; the protective material remaining within the openings duringthe anodic dissolution; and removing the protective material from withinthe openings prior to forming the dielectric material.
 31. The method ofclaim 30 wherein the protective material comprises photoresist.
 32. Themethod of claim 30 wherein the protective material comprises PSG. 33.The method of claim 21 wherein the conductive masses have sidewallsurfaces along the mass, and further comprising: removing at least someof the substrate to expose at least portions of the sidewall surfaces ofthe conductive masses; and forming the dielectric material along theexposed portions of the sidewall surfaces.
 34. A method of formingcapacitor constructions, comprising: providing a substrate; forming afirst electrically conductive material over the substrate; formingopenings extending through the first electrically conductive materialand into the substrate; forming a second electrically conductivematerial within the openings and over the first electrically conductivematerial, the second electrically conductive material being differentfrom the first electrically conductive material, the second electricallyconductive material entirely filling the openings; subjecting the secondelectrically conductive material to anodic dissolution; the firstelectrically conductive material being electrically connected to a powersource during the anodic dissolution; the second electrically conductivematerial within the openings becoming electrically isolated from thefirst electrically conductive material during the anodic dissolution andremaining within the openings as spaced conductive masses after theanodic dissolution; the spaced conductive masses having sidewallsurfaces; removing the first conductive material from over thesubstrate; removing some of the substrate to expose at least portions ofthe sidewall surfaces of the conductive masses; forming dielectricmaterial over the spaced conductive masses and along the exposedportions of the sidewall surfaces; and forming capacitor electrodematerial over the dielectric material and capacitively separated fromthe conductive masses.
 35. The method of claim 34 wherein a sufficientamount of the substrate is removed to expose an entirety of the sidewallsurfaces.
 36. The method of claim 34 wherein the substrate comprises anelectrically insulative material, and wherein the openings extend intothe electrically insulative material.
 37. The method of claim 34 whereinthe substrate comprises an electrically insulative material overconductive electrical nodes, wherein the openings are formed to extendthrough the electrically insulative material and to the electricalnodes; and wherein the second conductive material is formed in physicaland electrical contact with the electrical nodes.
 38. The method ofclaim 34 wherein the first electrically conductive material and secondelectrically conductive material are oxidized during the anodicdissolution, and wherein the second electrically conductive material isoxidized more rapidly than the first electrically conductive materialduring the anodic dissolution.
 39. The method of claim 34 the firstelectrically conductive material comprises tungsten and the secondelectrically conductive material comprises one or more of platinum,rhodium, iridium, ruthenium.
 40. The method of claim 34 whereinchemical-mechanical polishing is utilized to remove the first conductivematerial from over the substrate.
 41. The method of claim 34 wherein thesubstrate comprises an electrically insulative material over amonocrystalline silicon base; and wherein the openings extend into theelectrically insulative material.